Team Group | TLZRD416G3600HC18J01

T-Force Vulcan Z's cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering a smooth gaming experience and an extreme performance without any lag.